Solder joint failures under thermo-mechanical loading conditions – A review
نویسندگان
چکیده
منابع مشابه
Solder joint reliability under realistic service conditions
The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed ampl...
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ژورنال
عنوان ژورنال: Advances in Materials and Processing Technologies
سال: 2020
ISSN: 2374-068X,2374-0698
DOI: 10.1080/2374068x.2020.1751514